Burn-in test probe for fine-pitch packages with side contacts

摘要

A splay-free test probe for maintaining high conductivity is described. A matrix of electrical pins are molded into the side walls of a probe head. The side surfaces of the probe head are milled such that the longitudinally exposed surfaces of the exposed pins are flushed with the side surfaces of the probe head. The longitudinal exposed surfaces of the pins become the contact surfaces of the test probe. The width of the contact surfaces is less than 50% of the cross-sectional diameter of the pins. Notwithstanding repeated insertions, the test probe ensures splay- free performance. The contact surfaces around the tips of the stainless steel pins are milled at an angle with respect to plane of the side walls of the probe head to facilitate the probe head's entry into the IC socket. While the probe head is inserted into IC socket, the stainless steel contact surfaces of the probe head remove contaminants from the socket pins. In the process, the electrical contact between the IC sockets and the IC pins is improved. The test probe not only can be customized to any specification of IC sockets, but it also ensures that the cross-sectional dimension and electrical conductivity of the IC package is accurately and reliably simulated.