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Solid high aspect ratio via hole used for burn-in boards, wafer sort probe cards, and package test load boards with electronic circuitry
Solid high aspect ratio via hole used for burn-in boards, wafer sort probe cards, and package test load boards with electronic circuitry
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机译:实心高纵横比通孔,用于老化板,晶圆分选探针卡和带有电子电路的封装测试负载板
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摘要
A method, and apparatus resulting from the method, for fabricating a circuit board suitable for mounting electronic components. The method includes drilling a plurality of through-holes in a plurality of dielectric sheets, forming a conductive film on at least one side of each of the plurality of dielectric sheets, and substantially filling each of the plurality of through holes with a conductive material. The conductive material is both electrically and thermally uninterrupted from a first face to a second face of each of the plurality of dielectric sheets. The plurality of dielectric sheets are then sequentially mounted, on atop another, to form the circuit board. The sequential mounting step is performed after the steps of drilling the plurality of through-holes, forming the conductive layer, and substantially filling the plurality of through-holes.
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