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Integrated circuit structure including CMOS devices protected by patterned nitride passivation and method for the fabrication thereof

机译:包括受图案化氮化物钝化保护的CMOS器件的集成电路结构及其制造方法

摘要

A CMOS integrated circuit structure is disclosed having a patterned nitride passivation layer, wherein the nitride is patterned such that it does not overlie the thin gate oxide portions of one or more of the MOS devices. When protection against the effects of external radiation is desired, the thin gate oxide areas of the PMOS devices are left uncovered by the patterned nitride passivation layer. When protection is desired against the effects of internally generated "hot electrons", the thin gate oxide areas of the NMOS devices are left uncovered by the patterned nitride passivation layer.
机译:公开了一种具有图案化的氮化物钝化层的CMOS集成电路结构,其中所述氮化物被图案化为使得其不覆盖一个或多个MOS器件的薄栅极氧化物部分。当需要保护免受外部辐射的影响时,PMOS器件的薄栅极氧化物区域未被图案化的氮化物钝化层覆盖。当需要针对内部产生的“热电子”的影响进行保护时,NMOS器件的薄栅氧化层区域就不会被构图的氮化物钝化层覆盖。

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