Soldered manner null of leading/reading the surface implemental

摘要

PURPOSE:To prevent solder bridges by placing solder paste layers in a zigzag form with respect to neighboring foot prints. CONSTITUTION:Solder paste layers 14, 15 are formed by using a screen printing apparatus having a plate in which printing openings are placed in a zigzag form. A lead 2 is deposited on corresponding foot prints 11-1, 11-2 so as to oppositely face it. By making it pass through a reflow furnace, the layers 14, 15 and the surface of a solder plated layer 13 are melted and the lead 2 is soldered. As a result, melted solder paste flows mainly in a direction in which paste lacks and the flowing-out in an axial direction of foot prints is limited, thereby preventing solder bridges.