Formation manner of solder bump and implemental manner null of solder

摘要

PROBLEM TO BE SOLVED: To provide a method of surely forming solder bumps and mounting bumps. ;SOLUTION: A solder ball 15 is soldered to a circuit electrode 12 via of a through-hole 13 provided to an insulating board 11 for forming a solder bump 16 on the surface of the insulating board 11 opposite to its other surface which confronts the circuit electrode 12. In this case, the solder ball 15 is mounted on the through-hole 13 whose diameter is smaller than that of the solder ball 15, a creamy solder 14, which contains solder particles 14a that are each large enough in size to come into contact with both the surfaces of the solder ball 15 and the circuit electrode 12, is fed into the through-hole 13, the insulating board 11 is heated after the solder ball 15 is mounted on the through-hole 13 have the solder ball 15 and the solder particles 14a melted. With this setup, the solder particles 14a function as a bridge to span a space between the solder ball 15 and the surface of the circuit electrode 12, whereby the melted solder can be prevented from separating off.;COPYRIGHT: (C)1999,JPO