Preliminary soldered manner null of lead/read

摘要

PURPOSE:To improve reliability of a lead pin by providing a reflection film on the rear of heat resistant transparent substrate to make a window section only for the position corresponding to a lead pin and by applying infrared heating from the rear side of the substrate after positioning the lead pin to a circular pattern of solder paste which is provided at a position corresponding to a window section on the surface of the transparent substrate. CONSTITUTION:Pyrex glass is used for a transparent substrate 1 and a reflection film 2 is formed thereon by chrome through vacuum evaporation, then a window section 3 is shaped thereon in matrix using photolisography. The transparent substrate 1 is placed upside down with the reflection film 2 downward then solder paste 4 which consists of tin/lead eutectic solder is formed in a circular pattern by screen printing method, positioned on the transparent substrate 1 which is provided on the window section 3. A lead pin 5 of a package is positioned on the solder paste 4 and infrared ray 6 is irradiated thereto with the lead pin pressed, from under the transparent substrate 1 through an infrared ray lamp to heat solder paste 4 for soldering of the lead pin 5. A stable circuit connection is thus conducted to a pad of a printed board.