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HIGH DIELECTRIC CONSTANT BARIUM-STRONTIUM-NIOBIUM OXIDES FOR INTEGRATED CIRCUIT APPLICATIONS

机译:高介电常数钡-锶-铌氧化物在集成电路中的应用

摘要

A charge storage device (50, 91), such as an integrated circuit memory (91),including a dielectric (56, 89) comprising a barium-strontium-niobium oxide. Aliquid precursor including the metals barium, strontium, and niobium isprepared and applied to a platinum electrode (55, 88). The precursor is bakedand annealed to form a dielectric (56, 89) having the formula BaxSryNbzO30,where x = 1.3 to 3.5, y = 1.5 to 3.7, and z = 10. A top platinum electrode(63, 90) is then formed to provide a memory cell capacitor (50, 84). Optimumresults to date have been obtained with Ba2Sr3Nb10O30, which yields a memorycell dielectric with dielectric constant over 1000 and a leakage current ofless than 10-5 amperes per square centimeter for voltages up to 5 volts.
机译:电荷存储装置(50、91),例如集成电路存储器(91),包括包含钡-锶-铌氧化物的电介质(56、89)。一种包括金属钡,锶和铌的液态前驱体为制备并施加到铂电极(55、88)上。前体被烘烤并退火以形成具有式BaxSryNbzO30的电介质(56、89),其中x = 1.3至3.5,y = 1.5至3.7,z =10。顶部铂电极然后形成(63、90)以提供存储单元电容器(50、84)。最佳迄今为止的结果已通过Ba2Sr3Nb10O30获得,产生了记忆介电常数超过1000且漏电流为对于高达5伏的电压,每平方厘米小于10-5安培。

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