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High dielectric constant barium-strontium-niobium oxides for integrated circuit applications
High dielectric constant barium-strontium-niobium oxides for integrated circuit applications
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机译:用于集成电路的高介电常数钡锶铌氧化物
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摘要
A charge storage device, such as an integrated circuit memory, including a dielectric comprising a barium-strontium-niobium oxide. A liquid precursor including the metals barium, strontium, and niobium is prepared and applied to a platinum electrode. The precursor is baked and annealed to form a dielectric having the formula Ba.sub.x Sr.sub.y Nb. sub.z O.sub.30, where x=1.3 to 3.5, y=1.5 to 3.7, and z=10. A top platinum electrode is then formed to provide a memory cell capacitor. Optimum results to date have been obtained with Ba.sub.2 Sr.sub.3 Nb.sub. 10 O.sub.30, which yields a memory cell dielectric with dielectric constant over 1000 and a leakage current of less than 10.sup.-5 amperes per square centimeter for voltages up to 5 volts.
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