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High dielectric constant barium-strontium-niobium oxides for integrated circuit applications

机译:用于集成电路的高介电常数钡锶铌氧化物

摘要

A charge storage device, such as an integrated circuit memory, including a dielectric comprising a barium-strontium-niobium oxide. A liquid precursor including the metals barium, strontium, and niobium is prepared and applied to a platinum electrode. The precursor is baked and annealed to form a dielectric having the formula Ba.sub.x Sr.sub.y Nb. sub.z O.sub.30, where x=1.3 to 3.5, y=1.5 to 3.7, and z=10. A top platinum electrode is then formed to provide a memory cell capacitor. Optimum results to date have been obtained with Ba.sub.2 Sr.sub.3 Nb.sub. 10 O.sub.30, which yields a memory cell dielectric with dielectric constant over 1000 and a leakage current of less than 10.sup.-5 amperes per square centimeter for voltages up to 5 volts.
机译:电荷存储设备,例如集成电路存储器,包括电介质,该电介质包括钡锶锶铌氧化物。制备包括金属钡,锶和铌的液体前体,并将其施加到铂电极上。对该前体进行烘烤和退火,以形成具有式Bax Sry Nb的电介质。 sub.z O.sub.30,其中x = 1.3到3.5,y = 1.5到3.7,z = 10。然后形成顶部铂电极以提供存储单元电容器。迄今为止,使用Ba.sub.2 Sr.sub.3 Nb.sub可获得最佳结果。 10 O.sub.30,产生的存储单元电介质的介电常数超过1000,对于5伏以下的电压,泄漏电流小于每平方厘米10 s-5安培。

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