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HIGH DIELECTRIC CONSTANT BARIUM-STRONTIUM-NIOBIUM OXIDES FOR INTEGRATED CIRCUIT APPLICATIONS

机译:高介电常数钡-锶-铌氧化物在集成电路中的应用

摘要

A charge storage device (50, 91), such as an integrated circuit memory (91), including a dielectric (56, 89) comprising a barium-strontium-niobium oxide. A liquid precursor including the metals barium, strontium, and niobium is prepared and applied to a platinum electrode (55, 88). The precursor is baked and annealed to form a dielectric (56, 89) having the formula BaxSryNbzO30, where x = 1.3 to 3.5, y = 1.5 to 3.7, and z = 10. A top platinum electrode (63, 90) is then formed to provide a memory cell capacitor (50, 84). Optimum results to date have been obtained with Ba2Sr3Nb10O30, which yields a memory cell dielectric with dielectric constant over 1000 and a leakage current of less than 10-5 amperes per square centimeter for voltages up to 5 volts.
机译:电荷存储装置(50、91),例如集成电路存储器(91),包括电介质(56、89),电介质(56、89)包括钡-锶-铌氧化物。制备包括金属钡,锶和铌的液体前体,并将其施加到铂电极(55,88)上。将前体烘焙并退火以形成具有式BaxSryNbzO30的电介质(56、89),其中x = 1.3至3.5,y = 1.5至3.7和z =10。然后形成顶部铂电极(63、90)以提供存储单元电容器(50、84)。迄今为止,使用Ba2Sr3Nb10O30可获得最佳结果,该器件产生的存储单元电介质的介电常数超过1000,电压最高5伏时,泄漏电流小于10-5安培/平方厘米。

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