首页> 外国专利> PROCESS FOR MANUFACTURING ELECTRONIC COMPONENTS USING SOFT SOLDERING FLUX BASED ON CARBOXYLIC ACIDS

PROCESS FOR MANUFACTURING ELECTRONIC COMPONENTS USING SOFT SOLDERING FLUX BASED ON CARBOXYLIC ACIDS

机译:利用基于羧酸的软熔剂制造电子元件的过程

摘要

this stream is preferably used in electronics and electricity. the special nature of this flow is easy to eliminate waste of welding, without time limit and the flow itself is self oxidatively degraded), as would be the case, for example, upon activation of the aromatic carboxylate acid flow.the relationship of corrosion properties and surface resistivity, as required by the testing standards according to din 8516 and din 8527 applied to halogen free flux, according to din 8511, type f - sw 32, are provided.the advantages of the flow are obtained by the introduction of mono -, di - or poly carboxylated alicyclic carbon ring having at least one or their derivatives using mono -, di - or poly - or keto carboxylates. the flow properties can also be improved by the joint use of quaternary ammonium salts.the basic composition described above provides products with various flow characteristics, which gives flexibility in their use (for example, flow applicable to welding procedures and welding fluid, pulp, parts of envelopes. e son to lead or lead wire cores.
机译:该物流优选用于电子和电力。这种流动的特殊性质很容易消除焊接浪费,没有时间限制,并且流动本身是自氧化降解的),例如在活化芳族羧酸盐流动时就是这种情况。并提供了符合DIN 8516和DIN 8527的测试标准所要求的,适用于无卤素助焊剂的表面电阻率,以及根据DIN 8511的f-sw 32型的表面电阻率。使用单,二或多或酮基羧酸盐的具有至少一种或它们的衍生物的二,多或二羧基化的脂环族碳环。结合使用季铵盐也可以改善流动性能。上述基本组成为产品提供了多种流动特性,这为产品的使用提供了灵活性(例如,适用于焊接工艺的流动以及焊接流体,纸浆,零件信封或引线芯线。

著录项

  • 公开/公告号EP0215773B2

    专利类型

  • 公开/公告日1997-01-22

    原文格式PDF

  • 申请/专利权人 KERNER RUDOLF A.;

    申请/专利号EP19840901992

  • 发明设计人 KERNER RUDOLF A.;

    申请日1984-05-14

  • 分类号B23K35/363;

  • 国家 EP

  • 入库时间 2022-08-22 03:21:02

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