Thin film multi-chip package

摘要

this design is the lead frame paddle of the laminate according to the chip contact is not in the range of a depth of. the thickness of laminate, as the thin film group film type multi chip package and a multi package, the existing problem and the thickness of the label the application of a lead frame using the laminate, metal press, and printed circuit board for use in, and the capacity of the existing package with a package film and an.