Bake process to improve the reliability and yield of electrical characteristics gender

摘要

The present invention relates to a baking process for improving the reliability and yield of electrical characteristic screening, and more specifically, adding a process of removing moisture and contaminants by applying heat before finishing the wafer manufacturing process and performing electrical screening. The present invention relates to a baking process for improving reliability and yield of electrical property selection by improving reliability and yield of electrical property selection.;In other words, by adding a baking process that is placed in an oven and heated to remove moisture and other contaminants, it removes moisture and other contaminants caused by backside polishing, thereby improving reliability and yield of electric property selection. It is possible to provide a baking process for improving the reliability and yield of selective electrical characteristics.