首页> 外国专利> Brief description of the interconnection between a circuit integrated and a circuit support, and adapts to this circuit integrated.

Brief description of the interconnection between a circuit integrated and a circuit support, and adapts to this circuit integrated.

机译:电路集成件与电路支撑件之间的互连的简要说明,并适用于该电路集成件。

摘要

The invention relates to a method of interconnecting an integrated circuit onto a carrier, as a replacement for the wiring. According to the invention, an integrated circuit chip (1) is fixed on a carrier (4) by brazing of the earth plane metallisations (18,20). However, the input/output lugs (7,13) of the integrated circuit are joined to the metallised tracks (8,9) of the carrier (4) by way of metallised holes (14,15). Application to microwave circuits. IMAGE
机译:本发明涉及一种将集成电路互连到载体上的方法,以代替布线。根据本发明,通过钎焊接地平面金属化层(18,20)将集成电路芯片(1)固定在载体(4)上。然而,集成电路的输入/输出接线片(7,13)通过金属化孔(14,15)连接到载体(4)的金属化轨道(8,9)。应用于微波电路。 <图像>

著录项

  • 公开/公告号FR2665574B1

    专利类型

  • 公开/公告日1997-05-30

    原文格式PDF

  • 申请/专利权人 THOMSON COMPOSANTS MICROONDES;

    申请/专利号FR19900009968

  • 发明设计人 QUENTIN PIERRE;

    申请日1990-08-03

  • 分类号H01L21/58;H01L23/498;

  • 国家 FR

  • 入库时间 2022-08-22 03:12:32

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