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ETCHING OF GAN SEMICONDUCTOR LAYER

机译:etching of Gan semiconductor layer

摘要

PROBLEM TO BE SOLVED: To provide a method for etching an electrically conductive GaN semiconductor layer formed on a substrate in accordance with the design basis. ;SOLUTION: In this method, when an electrically conductive GaN semiconductor layer 6 formed on a substrate 1 via a buffer layer 5 is etched, a metallic layer 3 is formed in a place, where etching is to be carried out on the substrate 1, and the buffer 5 and the electrically conductive GaN semiconductor layer 6 are formed in this order on the surface of the substrate including this metallic layer 3, and a protecting film 7 is formed in a region 6B, where no etching is to be carried out. Then, electrolytic erosion treatment is carried out by using the electrically conductive GaN semiconductor layer 6, connected to a metal plate 9 as an anode within an alkaline electrolyte solution.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:根据设计基础,提供一种用于蚀刻形成在衬底上的导电GaN半导体层的方法。 ;解决方案:采用这种方法,当蚀刻通过缓冲层5在基板1上形成的导电GaN半导体层6时,在要对基板1进行蚀刻的地方形成金属层3。并且,在包括该金属层3的基板的表面上依次形成缓冲层5和导电性GaN半导体层6,在不进行蚀刻的区域6B中形成保护膜7。然后,通过使用连接到金属板9上的导电GaN半导体层6作为碱性电解液中的阳极进行电解腐蚀处理。版权所有:(C)1998,日本特许厅

著录项

  • 公开/公告号JPH10256226A

    专利类型

  • 公开/公告日1998-09-25

    原文格式PDF

  • 申请/专利权人 FURUKAWA ELECTRIC CO LTD:THE;

    申请/专利号JP19970055028

  • 发明设计人 YOSHIDA KIYOTERU;

    申请日1997-03-10

  • 分类号H01L21/3063;C25F3/12;

  • 国家 JP

  • 入库时间 2022-08-22 03:07:52

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