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ETCHING SOLUTION FOR SILVER THIN FILM AND METHOD FOR ETCHING SILVER THIN FILM

机译:银薄膜的蚀刻溶液和银薄膜的蚀刻方法

摘要

PROBLEM TO BE SOLVED: To produce an acidic etching soln. for silver thin film capable of using an alkali type etching resist, inodorous at the time of etching silver thin film and furthermore free from the generation of harmful gases and to provide a method for efficiently etching silver thin film at a low cost by using this etching soln. ;SOLUTION: This etching soln. for silver thin film is composed of an acidic aq. soln. cong. ferric sulfate as effective components. Furthermore, this method for etching silver thin film is the one in which, at the time of etching silver thin film by using the etching soln., the specific gravity of the etching soln. in an etcher 1 is measured, based on this measured result, an etching soln. having a prescribed compsn. thinner than the prescribed compsn. of the etching soln. is fed to the etcher 1, and the specific gravity is regulated to the prescribed value.;COPYRIGHT: (C)1998,JPO
机译:要解决的问题:生产酸性蚀刻液。用于能够使用碱型抗蚀剂的银薄膜,在蚀刻银薄膜时无臭并且不产生有害气体的银薄膜,并且提供了一种通过使用该蚀刻以低成本有效地蚀刻银薄膜的方法soln。 ;解决方案:这种蚀刻溶液。用于银的薄膜是由酸性水溶液组成的。 soln。 g硫酸铁为有效成分。此外,这种用于蚀刻银薄膜的方法是其中在通过使用蚀刻溶液对银薄膜进行蚀刻时,蚀刻溶液的比重的方法。基于该测量结果,测量蚀刻机1中的蚀刻液。具有规定的备件。比规定的化合物薄。腐蚀液。送入蚀刻机1,比重调节到规定值。版权所有:(C)1998,日本特许厅

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