Wire bonding method and copper-based lead frame used therefor

摘要

PURPOSE:To limit the degrading of bondability without noble-metal plating by forming an oxide film on a copper-base lead frame, holding the lead frame in a reductive gas atmosphere, and carrying out bonding in a non-oxidative atmosphere. CONSTITUTION:An oxide film is formed at least on bonding areas of a copper- base lead frame, and the lead frame is held in a reductive gas atmosphere to reduce the oxide film. After this reduction process, wire bonding is carried out in a non-oxidative atmosphere. Wire bonding according to this method does not require noble-metal plating while maintaining good bondability.