BONDING METHOD OF LEAD WIRE, BONDING DEVICE OF LEAD WIRE, AND PRESSURIZED FRAME

摘要

PROBLEM TO BE SOLVED: To provide a bonding method of a lead wire excellent in productivity, and not generating loosening to a plurality of conducting wires of the lead wire; and to provide a bonding device of the lead wire, and a pressurized frame.SOLUTION: A lead wire 1 comprising a plurality of conducting wires and a terminal 2 are bonded together by resistance welding. A bonding method of the lead wire includes a juxtaposition process for juxtaposing the plurality of conducting wires in the lead wire 1 and the terminal 2, and an integration process for resistance-welding integrally the plurality of conducting wires 1a and the terminal 2, by compressing a plurality of conducting wires in a plurality of lead wires 1 from mutually-different at least two axial directions by separable first frame 11 and second frame 12.SELECTED DRAWING: Figure 1