Manufacturing method of printed wiring board for high heat dissipation package

摘要

This invention describes the manufacturing method of the printed wiring board used for a high heat dissipation package. This method comprises the steps of preparing a plurality of printed wiring boards having a predetermined shape of a wiring circuit and having die pad regions for mounting semiconductor chips of different sizes, sequentially stacking the plurality of printed wiring boards, and punching process. Forming a penetrating tool penetrating through the printed wiring boards laminated by the step, plating the inner surface of the punching tool, and applying a phase-transferable adhesive to the lower surface of the stacked printed wiring boards And bonding a thin film made of a conductive material to the adhesive, embedding the drilling tool by the adhesive by applying a force to the thin film under a high temperature atmosphere, and conducting the thin film plated on the drilling tool. Is electrically connected to the. Therefore, according to the present invention, the through-hole formed in the printed wiring board through the adhesive which is phase-changed to the gel state by the action of the force applied from the outside in a high temperature atmosphere, the through-hole during the manufacturing process of the semiconductor package to be performed later Not only can the adhesive for attaching the die pads flow through the sphere, but also the reliability of the package can be improved.