Discharge bar structure of wire bonding device

摘要

The present invention provides a structure of a discharge rod of a wire bonding apparatus in which the tip of the discharge rod is formed in a circular ring to reduce the distance change between the tip of the wire to be initially formed and the tip of the discharge rod and to reduce the size of the initial ball. It is about.;Accordingly, it is an object of the present invention to provide a discharge rod structure of a wire bonding apparatus in which a change in initial ball size of a bonding wire is reduced to prevent a defect in a wire bonding process from occurring.;In order to achieve the above object, the present invention forms a tip of the discharge rod of the wire bonding device in a circular ring so that the distance between the wire tip and the ring of the discharge rod may be changed even if the shape and position of the wire tip to be formed in the initial ball are changed. It is characterized in that to reduce the initial change in the size of the ball and also to prevent the occurrence of defects in the bonding process.