Inductor device using substrate conversion technology and manufacturing method thereof

摘要

The present invention relates to an inductor used for impedance matching in a radio frequency integrated circuit ("RFIC") design and a manufacturing method thereof. In the integrated inductor device provided according to the present invention, an electrode is further disposed around the inductor wiring, By applying a reverse voltage between the substrate and the electrode, a depletion layer is formed inside the substrate. Thus, substrate conversion can be made to reduce the parasitic capacitance between the inductor metal line and the substrate, thereby producing an inductor with improved performance. The present invention is also applicable to other semiconductor devices having metal wiring and pads.