The present invention relates to a lead frame fixing device of a wire bonder used in a wire bonding process, which is one of the semiconductor package manufacturing processes. In the lead frame fixing device of a wire bonder, a heater block in which a die bonded lead frame is transferred and seated A plurality of vacuum holes for fixing the leads and paddles of the lead frame 1 to (2) are formed in accordance with the lead position and the paddle position of the lead frame 1 to be fixed by vacuum to lead frame during wire bonding. It is configured to more certainly prevent the flow of leads and paddles.
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