LEAD FRAME FIXING METHOD BY WIRE BONDER AND FIXING APPARATUS

摘要

PROBLEM TO BE SOLVED: To block an oscillation generated during wire bonding in a region of IC being wire-bonded by retaining the periphery of a bonding post of a lead frame with a protrusion of a frame retainer and retaining the periphery of the protrusion with an auxiliary retainer. SOLUTION: A lead frame 11 is first fixed with a heat stage 24 and second protrusion 16 and finally fix the periphery of a bonding post with a protrusion 15a of a frame retainer. As the result, a vibration produced during bonding is almost blocked by the protrusion 15a of the retainer and since second protrusion 16 disposed at its periphery is made of a high elasticity material, it can contact with the lead frame enough to perfectly block the vibration whereby the vibration produced during bonding can be blocked within the region of an IC 12a being bonded and the damage caused to a bonded IC 12b by the vibration can be minimized.