PARTS FOR FLIP CHIP BONDING, COMPONENT FOR CONFIRMING FLIP CHIP BONDING, AND FLIP CHIP BONDING METHOD

摘要

PROBLEM TO BE SOLVED: To confirm both of bonding accuracy and electrical continuity by setting components for flip chip bonding being used for bonding to transparent glass with substrate components and chip components. SOLUTION: A substrate component 10 for confirmation and chip component 30 for confirmation use a plate-shaped member consisting of transparent glass. In the chip component 30 for confirmation, a black direction alignment mark 40 is formed in a position corresponding to a direction alignment mark 20 of the substrate component 10 for confirmation, where the mark 40 has the same shape as the direction alignment mark 20 and a slightly thinner width than that of the mark 20. Also, an X-axis measurement scale 41 and a Y-axis measurement scale 42 are formed at a position corresponding to an X-axis measurement scale 21 of the substrate component 10 for confirmation and an X-axis scale base line 23 and a Y-axis scale base line 24 of a Y-axis measurement scale 22, thus confirming both of bonding accuracy and electrical continuity.