SUBSTRATE FOR FLIP-CHIP BONDING AND METHOD FOR TESTING THE FLIP-CHIP BONDING

摘要

PROBLEM TO BE SOLVED: To flip-chip bond elements highly densely, to make them compact, and to improve the accuracy of a bonding test in a semiconductor chip with staggered bump electrodes. SOLUTION: In a substrate for flip-chip bonding, in which a semiconductor chip having a plurality of staggered bumps 52 are flip-chip bonded to a plurality wirings 34 corresponding thereto, a pad 36, first and second extensions 38, 40 are formed each wiring 34. The pad 36 is staggered, such that it corresponds to bump 52 and the bump has an area and a shape, which is adequate for the flip-chip bonding. The first extension 38 is made narrower than the pad 36 to prevent an interference with the neighboring wirings. The second extension 40 has straight base sides 42, extending continuously in the width direction from the outer periphery of the pad 36.