Implemental structure and its production manner null

摘要

PROBLEM TO BE SOLVED: To make smaller the LSI mounting region, which opposes to a tape carrier substrate, by a method wherein LSI external connection terminals and wire bonding pads are connected with each other by wires through opening parts. ;SOLUTION: LSI external connection terminals 7 are provided on the peripheral region of the lower surface of an LSI 1 and wire bonding pads 9 are provided on the main surface, which does not oppose to the LSI 1, of a tape carrier substrate 3. The terminals 7 and the pads 9 are connected with each other by wires 4 through open parts 8. For this, the mounting region, which opposes to the substrate 3, of the LSI 1 can be made smaller. Moreover, a wiring 10 can be formed on the surface, which does not oppose to the LSI 1, of the region which mounts the LSI 1, of the carriage 3 and at the same time, as a gap is formed between the surface and the substrate, heat, which is generated from the LSI 1, can be made to dissipate from the gap. Moreover, a special jig and a process for an ILB can be dispersed with.;COPYRIGHT: (C)1998,JPO