The electronic parts where it becomes production manner of the lamination die electronic parts implemental end part and, production manner, and the electronic parts implemental end end item null thermoplastics material

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a part with already mounted multilayer electronic components whose thickness can be reduced and for which there are few restrictions with respect to usable electronic components, and to provide a method for manufacturing a completed product with already mounted multilayer electronic components and a completed product with already mounted electronic components. SOLUTION: Since core modules 200-201 incorporating electronic components which are formed by embedding a semiconductor device in a first thermoplastic resin substrate 50 are layered, the thickness of the part with already mounted multilayer electronic components can be reduced by the thickness of a conventional carrier substrate. Also, since this method does not adopt the wire bonding method, components are not limited to semiconductor devices around which electrodes are placed and their size is not also limited.