Production manner and surface implemental die electronic parts null of surface implemental die

摘要

PURPOSE: To solder a surface mount device to a circuit board without causing defective bonds by giving its electrodes solder bumps with a recess in the center so that they can seat on conductive projections on the board to correctly position the device. ;CONSTITUTION: A surface mount device has electrodes T each provided with a solder bump 21 having a recess in the center. For example, a ring-shaped solder bump 21 with a recess 21A in the center is formed on the electrode pad of a surface mount device, such as a flip chip IC. Such a device is mounted on a circuit board in such a manner that the recessed bumps seat on conductive projections on the board. Then, the surface mount device is soldered to the board by heating.;COPYRIGHT: (C)1995,JPO