The electronic parts where it becomes production manner of the electronic parts implemental end part and, production manner, and the semiconductor component mounting end end item null thermoplastics material

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a high-quality, high-productivity and low-cost component mounted with an electronic component, to provide a method of manufacturing a finished product mounted with an electronic component and to provide the finished product mounted with the electronic component. SOLUTION: An electronic component 104 is embedded in a first thermoplastic resin substrate 122, and a circuit pattern 118 is formed on the electronic component 104. Thereby, a core module component 101 with the built-in electronic component is manufactured. After that, it is laminated with a second thermoplastic resin substrate 124 and a third thermoplastic resin substrate 125. Thereby, a core-module finished product with the built-in electronic component is manufactured. Thereby, a step does not exist on the surface of the electronic component 104 and the first substrate 122, and a defect such as a swell, a dent or the like is not generated in terms of appearance. Since an anisotropic conductive member is not used, a sheet substrate of low heat resistance can be used, and it is possible to provide the high-productivity and low-cost component mounted with electronic component and the finished product mounted with electronic component.