Manufacturing Method of Laminated Substrate, Ball Grid Array Module and Cavity Down Ball Grid Array Package

摘要

A cavity down type plastic ball grid array electronic package for use in high frequency (HF) applications is disclosed. Faraday cages are formed to protect active devices from external HF wave interference. The lateral side of the Faraday cage is constructed by zigzag connection of a row of solder balls to the plated through holes along the four edges of the substrate. The upper side of the Faraday cage is the metal reinforcement of the cavity down package electrically connected to the through hole, while the lower side thereof serves as the ground plane of the main board, which is properly connected to the solder balls.