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SEMICONDUCTOR PACKAGE SUBSTRATE SUPPORT STRUCTURES FOR BALL-GRID ARRAY CAVITIES, AND METHODS OF ASSEMBLING SAME
SEMICONDUCTOR PACKAGE SUBSTRATE SUPPORT STRUCTURES FOR BALL-GRID ARRAY CAVITIES, AND METHODS OF ASSEMBLING SAME
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机译:球栅阵列腔的半导体封装基板支持结构及其组装方法
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摘要
A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes.
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