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Structure of a ball-grid array package substrate and processes for producing thereof
Structure of a ball-grid array package substrate and processes for producing thereof
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机译:球栅阵列封装基板的结构及其制造方法
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摘要
An improved structure of a ball-grid array (BGA) package substrate and processes for producing thereof are disclosed, wherein one side of the BGA substrate has a single pattern layer for connecting with solder balls and a heat sink layer is bonded to the other side of the substrate. The heat sink layer provides not only heat dissipation for the substrate, but also patterns for power and/or for ground, so as to diminish the dimension required for the patterns for power and/or for ground on the pattern layer of the substrate. The solder balls for power and/or for ground of the substrate are connected with the heat sink layer through electrically and thermally conductive via holes plugged with conductive paste.
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