THE SOLDER ALLOY OF SN-ZN-BI-PB FOR REDUCING PB

摘要

In electric and electronic parts, solders containing 40 to 70 wt% (wt. Percent) of lead (Pb) are still widely used when soldering copper and copper alloys. It is seriously pointed out as a pollution problem.;In view of the above, the present invention develops a new brazing alloy having an extremely small amount of lead (Pb), thereby preventing pollution by fundamentally suppressing the emission of lead (Pb), which is a heavy metal, and collecting dust of lead (Pb). The aim was to contribute to the need for no special consideration of the installation.;In the new soldering alloy of the present invention, the focus point is the soldering temperature, the soldering speed, the viscosity of the soldering material in the molten state, the wettability with the soldering material, the gloss after the soldering, and the like. Compared to ash, it is intact.;On the other hand, the novel brazing alloy of the present invention alloys tin (Sn) and zinc (Zn) at a ratio of about 10 to 1, and the melting point is 200 ° C on the tin (Sn) -zinc (Zn) binary alloy state diagram. It was set as the lowest low melting process alloy of degree. In consideration of the soldering characteristics such as viscosity, wettability, solidification rate and gloss after solidification in the molten state, 0.1 to 3.0 wt% (weight percent) of bismuth (Bi) and 0.1 to 3.0 wt% (weight) of lead (Pb) Alloy) in the range of percent).