PbSn solder alloy powder and PbSn solder alloy ball null for paste

摘要

PROBLEM TO BE SOLVED: To provide a powdery Pb-Sn solder alloy for a solder paste and a Pb-Sn solder alloy ball, which are used to form a bump that has a small number of voids and dents generated, and to provide a solder paste containing the powdery Pb-Sn solder alloy.;SOLUTION: Each of the powdery Pb-Sn solder alloy and the Pb-Sn solder alloy ball contains 1-65 mass% Sn and the balance Pb with inevitable impurities. The content of Ni contained as the above inevitable impurity is ≤2 ppm. Further, a paste containing the above powdery Pb-Sn solder alloy is provided.;COPYRIGHT: (C)2010,JPO&INPIT