BGA Solder ball tool in solder ball bumping system in semiconductor package

摘要

The present invention relates to a solder ball tool system of a solder ball bumping system of a BGA semiconductor package. In the prior art, when a solder ball is placed on a PCB land, the solder ball tool is manually handled with a flux and is supplied with tweezers and tweezers Accordingly, the solder ball can not be accurately supplied due to the operator's abrasion, the workability of the feeder is deteriorated, and the problem of defective product is caused.;A solder ball bumping system for supplying a solder ball to a PCB of a BGA semiconductor package includes a tool fastener for easily attaching and detaching a tool for attaching a solder ball to a solder ball tool so that the solder ball tool can be easily attached and detached. It is effective to increase the workability of the solder ball to be supplied to the PCB of the BGA semiconductor package and to improve the quality of the product.