SOLDER BALL ATTACHING APPARATUS WITH ENHANCED FIXING PART CAPABLE OF REPLACING QUICKLY EASILY SOLDER BALL ATTACH TOOL FOR BGA SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A solder ball attaching apparatus for a BGA(Ball Grid Array) semiconductor package is provided to improve productivity by removing easily quickly a solder ball attach tool from a support frame using an enhanced fixing part. CONSTITUTION: A solder ball attaching apparatus(100) includes a solder ball attach tool(110) with a solder ball pickup head(111) and a support plate(112), a support frame(130) for fixing the support plate, a fixing part(120) for connecting fixedly the support plate and the support frame with each other, an attach tool lifter(140) and a work table(150). The fixing part includes a fixing pin(121) inserted through the support plate and the support frame, a cylinder(122), a moving shaft, and a pin fixing fork(124).