Solder Bump Formation Method for Flip Chip Mounting and Semiconductor Chip with Solder Bump

摘要

The present invention provides a plurality of metal pads for electrically connecting an integrated circuit and an external connection means, a portion of which the metal pads are opened to expose a first passivation layer formed to cover the upper surface of the silicon substrate, and a metal pad. Preparing a silicon substrate having a second passivation film formed to have an open area and covering the upper surface of the first passivation film; Forming solder on the open region and the upper portion of the second passivation layer; And reflowing the portion where the solder is higher than the second passivation layer to have a ball shape, and a method of forming a solder bump for flip chip bonding, an integrated circuit and A plurality of metal pads formed by being electrically connected to each other, a first protective film covered on the upper surface of the silicon substrate to have an open area to which the metal pad is exposed, and formed on the upper surface of the first protective film to protect the silicon substrate from an external environment A semiconductor chip having a second protective film and a bump formed on a metal pad, wherein the solder is in an open area of the second protective film and the upper portion of the second protective film has a ball shape. to be. According to this, the height of the solder bumps is increased by the thickness of the second passivation layer to improve the reliability of the electrical connection, and even after undermounting, the flux residue can be prevented from remaining between the solder bumps and the second passivation layer. It works.