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Method of manufacturing flip-chip mounted solder bump for semiconductor device and solder bump manufactured thereby
Method of manufacturing flip-chip mounted solder bump for semiconductor device and solder bump manufactured thereby
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机译:制造用于半导体器件的倒装芯片安装的焊料凸块的方法和由此制造的焊料凸块
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摘要
Silver-tin alloy solder bumps are fabricated by forming a masked underbump metallurgy layer on a microelectronic substrate, to define exposed portions of the underbump metallurgy layer, plating silver on the exposed portions of the underbump metallurgy, plating tin on the silver and reflowing to form silver-tin alloy solder bumps. Accordingly, silver-tin alloy is not plated. Rather, individual layers of silver and tin are plated, and then reflowed to form silver-tin alloy solder bumps.
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