MANUFACTURE OF FLIP CHIP MOUNTING SOLDER BUMP OF SEMICONDUCTOR DEVICE AND SOLDER BUMP MANUFACTURED BY THE SAME METHOD AND METHOD FOR ANALYZING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a flip chip mounting solder bump for a semiconductor device for using an alloy of silver and tin for the solder bump, and the solder bump manufactured by this method, and a method for analyzing this. SOLUTION: In a method for manufacturing the flip chip mounting solder bump for a semiconductor device to be mounted on a circuit board, on which a pattern has already been formed according to the characteristics of an element, a boundary film 14 is formed (1), a photo process is operated (2), silver 18 and tin 20 are plated successively on a region from which a photoresist is removed in the photo process (3), the photoresist is completely removed (4), the etching of the boundary film 14 is carried out (5), a reflow process is operated, and the silver 18 and the tin 20 successively formed by plating is mixed with a prescribed ratio so as to be turned into alloy (6).