Flip-chip type semiconductor die mounting method for DRAM manufacture, involves fixing semiconductor die to lead frame through contact points on die, bumps formed over contact points and solder layer deposited on lead frame

摘要

Several bumps (13) are formed over the electric contact points (10) on the semiconductor die (11). Solder layers (14) are deposited on lead fingers of lead frame (12). Semiconductor die and the lead frame are fixed together through the contact points, bumps and the solder layers.