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Semiconductor device having LDD structure with a recess in the source/drain region which is formed during the removal of a damaged layer

机译:具有LDD结构的半导体器件,其在源/漏区中具有凹陷,该凹陷在去除受损层期间形成

摘要

To obtain a semiconductor device which prevents an increase in the resistance of a source/drain region; which operates fast and stably; and which provides a high manufacturing yield, and to obtain a method of manufacturing the semiconductor device. A recess 8 is formed on a first low impurity-concentration region 5 with the exception of the area immediately below side wall insulating material 6y, and a layer damaged as a result of formation of the side wall insulating material 6y is removed. Further, a second low impurity-concentration region 10 is formed below the recess 8.
机译:获得一种防止源/漏区的电阻增加的半导体器件;运行快速稳定并且提供了高的制造成品率,并且获得了制造半导体器件的方法。除了在侧壁绝缘材料6y正下方的区域之外,在第一低杂质浓度区域5上形成有凹部8,并且去除了由于形成侧壁绝缘材料6y而损坏的层。此外,在凹部8的下方形成第二低杂质浓度区域10。

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