FORMING METHOD OF UPPER MAGNETIC POLE LAYER OF THIN FILM MAGNETIC HEAD, FORMING METHOD OF FINE BLOCK PATTERN OF HIGH ASPECT RATIO ON BOTTOM OF STEP ON SURFACE HAVING STEPS, AND THIN FILM MAGNETIC HEAD

摘要

PROBLEM TO BE SOLVED: To improve the face recording density by successively forming two resist layers of different thickness, patterning the second resist layer into a flat form of an upper magnetic pole layer, using the patterned first resist layer as a frame to form the upper magnetic pole layer on the region where a plating base film is exposed.;SOLUTION: After an adhering layer 22, relatively thick first resist layer 23 and relatively thin second resist layer 24 are successively formed on a plating base film 21, a relatively thin photoresist layer 25 to pattern the second resist layer 24 is formed and hardened by heating. The patterned photoresist layer 25 is used as a mask to etch the second resist layer 24 to transfer the pattern to the layer 24. Then the layer 24 is used as a mask to etch the first resist layer 23, and the layer 23 is used as a mask to etch the adhering layer 22 to transfer the pattern to the adhering layer 22. The patterned first resist layer 23 is used as a frame for electroplating to form an upper magnetic pole layer 16.;COPYRIGHT: (C)2000,JPO