COMPOSITE FOIL, COPPER-CLAD LAMINATED MATERIAL, PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE OF THE COMPOSITE FOIL

摘要

PROBLEM TO BE SOLVED: To provide a composite foil of a structure, wherein the handling of an extremely thin copper foil is facilitated in the manufacture of a printed wiring board. ;SOLUTION: This composite foil consists of an aluminium support material 1, a protective layer provided on this support material 1 and an extremely thin copper foil provided on this protective layer, the protective layer consists of an electrodeposited copper layer 2, which is provided on the support material 1 and has apertures 6, and an electrodeposited zinc layer provided on this support material 1 and the layer 2 and one part of the zinc in the zinc layer is penetrated into the apertures 6 formed in the layer 2 to bond to the material 1, whereby the composite foil, which is characterized in that the peeling strength of the material 1 from the protective layer is controlled and the material 1 is made peelable from the protective layer, is provided.;COPYRIGHT: (C)2000,JPO