Electrodeposited Copper Foil with Carrier Foil on which a Resin Layer for Forming Insulating Layer is Formed, Copper-Clad Laminate, Printed Wiring Board, Method for Manufacturing Multilayer Copper-Clad Laminate, and Method for Manufacturing Printed Wiring Board

摘要

The present invention discloses a technology for a printed wiring board which uses a copper foil without roughening treatment. Therefore, electrodeposited copper foil with carrier foil which is sequentially constituted with carrier foil, bonding interface layer, electrodeposited copper foil with smooth surface on both side and a resin layer is employed. The resin composition constituting the resin layer is composed of 20 to 80 parts by weight of an epoxy resin which includes curing agent, 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer and curing accelerator in a suitable amount if required.