PHOTOCURABLE AND THERMOCURABLE RESIN COMPOSITION AND PRINTED CIRCUIT BOARD HAVING SOLDER RESIST FILM AND INSULATING RESIN LAYER BY USING SAME

摘要

PROBLEM TO BE SOLVED: To provide a photothermocurable resin composition developable in an aqueous alkaline solution and high in resolution and superior in resistance to heat and chemicals and moisture and PCT and superior in electric characteristics by incorporating a specified photosensitive prepolymer, a specified photopolymerization initiator, a reactive diluent, and an epoxy compound. ;SOLUTION: This photothermocurable resin composition comprises (A) the photosensitive prepolymer having ≥2 unsaturated double bonds and ≥1 carboxyl group in a molecule, (B) the photopolymerization initiator of a compound or its acid-added salt, represented by formula I and the like, (C) the reactive diluent, and (D) thr epoxy compound having ≥2 epoxy groups in one molecule. In the formulae Ar3 is a group represented by formula II or the one substituted by a halogen atom or the like; X is a simple bond or a -Ogroup or the like; Y is an H atom or a 1-12C alkyl group or the like; each of R1 and R2 is, independently, a 1-8C alkyl group or the like; R3 is an H atom or the like; and R4 is a 1-12C alkyl group or the like.;COPYRIGHT: (C)2000,JPO