首页> 外国专利> Pack designed to take, in particular, an electrical and/or electronic board, method for the manufacturing and assembley of a system comprising a corresponding pack and board

Pack designed to take, in particular, an electrical and/or electronic board, method for the manufacturing and assembley of a system comprising a corresponding pack and board

机译:设计成尤其采用电气和/或电子板的包装盒,用于制造和组装包括相应包装盒和板的系统的方法

摘要

Disclosed is a pack (20) designed to receive, in particular, one electrical and/or electronic board of the type comprising means to position and fixedly hold said board in said pack (20). Said positioning and fixed holding means comprise at least two supporting means, at least one of said supporting means (28, 29, 214, 215) being elastic,and at least one of said supporting means (28, 29, 214, 215) comprising a conductive part designed to co-operate electrically with at least one additional element located on said board. The disclosure also relates to methods for the manufacture of a pack and for the assembly of an electrical and/or electrical system comprising at least one pact and at least one corresponding electrical and/or electronic board.
机译:公开了一种包装盒(20),该包装盒设计成特别地容纳一种类型的电气和/或电子板,该电气和/或电子板包括将所述板定位并固定地保持在所述包装盒(20)中的装置。所述定位和固定保持装置包括至少两个支撑装置,所述支撑装置(28、29、214、215)中的至少一个是弹性的,并且所述支撑装置(28、29、214、215)中的至少一个包括导电部件,其设计成与位于所述板上的至少一个附加元件电协作。本公开还涉及用于制造包装和用于组装电气和/或电气系统的方法,该电气和/或电气系统包括至少一个销和至少一个相应的电气和/或电子板。

著录项

  • 公开/公告号EP1014771A1

    专利类型

  • 公开/公告日2000-06-28

    原文格式PDF

  • 申请/专利权人 LUCENT TECHNOLOGIES INC.;

    申请/专利号EP19990308393

  • 发明设计人 MARC JAN;

    申请日1999-10-25

  • 分类号H05K7/14;H05K9/00;

  • 国家 EP

  • 入库时间 2022-08-22 01:47:16

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