Vijay A semiconductor package and its manufacturing method

摘要

FIELD OF THE INVENTION The present invention relates to an improved busy semiconductor package and a method for manufacturing the stacked busy semiconductor package.;The semiconductor package for achieving the object of the present invention comprises a semiconductor chip (91) attached to the central recess (53) of the lower substrate (51); A wire 93 connecting one end of a wiring 59 on an upper surface of the lower substrate 51 to the semiconductor chip 91; An encapsulation member (97) surrounding the recess, the wire and the upper surface of the semiconductor chip (91); A lower through hole 55 having an upper portion wider than a lower portion at an outer side of the recess of the lower substrate 51; An upper substrate 71 having a conductive ball 95 mounted on the lower through hole 55 and an upper through hole 75 formed at a portion corresponding to the conductive ball 95 with an upper portion narrower than the lower portion is provided on the lower portion. It is adhered on the substrate 51.;The BG semiconductor package according to the present invention can be stacked up and down, thereby increasing the packaging mounting density while maintaining the advantages of the BG package.