Vijay package and manufacturing method

摘要

BGA package according to the present invention and a method of manufacturing the same can be produced by BGA (ball grid array) package by electrically connecting the semiconductor chip and the printed circuit board by metal wires and bonded them up and down with an elastic adhesive between them. .;Accordingly, the present invention can realize a chip scale package (CSP) that is easy to manufacture, reduces manufacturing costs, and secures reliability.