PACKAGING AND INTERCONNECTION OF CONTACT STRUCTURE

摘要

PURPOSE: Packaging and interchanger of contact structure provides a high yield, low cost and high reliability. CONSTITUTION: Packaging and interchanger of contact structure comprising a contact structure(30) formed on a contact substrate(20) with conductive material by a photo lithography process, is electrically connected on a contact trace(32); the contact trace(32) has a contact pad(33) on an end of contact trace(32); the upper side of the contact pad(33) is designed to connect with a contact target through a bonding wire(72). the bonding wire(72) connected with the contact pad(33) and a lead frame(45); the contact substrate(20) and the lead frame(45) are mounted on a support structure(52) by a adhesive. The bonding wire(72) is bonded with the contact pad(33) and then, leads to the lead frame(45) and clipped.