METHOD OF ANALYZING FAILURE OF SEMICONDUCTOR DEVICE BY USING EMISSION ELECTRON MICROSCOPE AND SYSTEM FOR ANALYZING FAILURE OF SEMICONDUCTOR DEVICE

摘要

[Problem] The failure analysis method of the semiconductor device by an emission microscope which can analyze current leak easily is calculated | required.;[Measures] Light emission information is stored on the X / Y memory space 16 in the Z direction as the light emission intensity.;The light emitting bits 17 in the light emission information mean bits determined to emit light, and the number of bits is determined based on the light emission intensity.;That is, the image memory 11 has a three-dimensional memory space in which the plane position of the light emission point is the X / Y space and the emission intensity is the Z space.;Then, by searching for the light emission information stored in the image memory 11, the position and intensity of light emission are detected to analyze the failure.