Cooling Cycle of Semiconductor Wafer Drying Equipment

摘要

The present invention relates to a cooling cycle of a semiconductor wafer drying apparatus. Conventionally, if the cooling function by the supply block of pure cooling water is lost, gaseous isoprene alcohol leaks out of the inner tank to cause the risk of fire, and the fire extinguisher is activated, so that the wafer in the inner tank is taken out by the fire extinguishing element. There was a problem that is not made smoothly. Accordingly, the present invention provides a constant pressure regulator for maintaining a constant pressure of the supplied pure coolant, a flow meter for adjusting the flow rate of the pure coolant supplied at a constant pressure by the constant pressure regulator, and a flow rate controlled by the flow meter. Measuring the temperature of the supplied and returned pure coolant by returning the cooling coil and outer tank and isoprene alcohol drain tank cooled by the purified pure coolant, returning pure coolant through the outer tank and isoprene alcohol drain tank In the configuration of the temperature sensing sensor, the switching valve is installed on the pipeline and the return line for supplying the pure cooling water to the positive pressure regulator side, and the DI water supply line and the DI water discharge line connected to the switching valve, respectively, the gas in the inner tank Due to leakage of isoprene alcohol Not only it can prevent the risk of material as well will have the effect that can talk to the performance and reliability of operation of the device it is possible to prevent the wafer in the inner tank out of the fire extinguisher operation.